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 recommended reading     NXP launched a complete radar sensor solution   recently, NXP announced the launch of a complete radar sensor chipset solution suite, which can protect vehicle safety in a 360 degree range and has the identification and classification functions of imaging radar. The solution is composed of NXP radar processor and 77GHz transceiver, which provides a variety of different configurations for automobile manufacturers. These configurations can meet the NCAP requirements of steering and front-end radar applications, and provide the commercial feasibility of mass production of 4D imaging radar. 4D imaging radar extends the function of radar from measuring range and velocity to include direction, angle of arrival and elevation measurement. Radar is the core of advanced driving assistance (ADAS) technology, suitable for traditional car manufacturers focusing on L1-L3 automatic driving, as well as developing L4 and L5 unmanned taxis and safe application delivery as service innovators. NXP's new radar sensor solution suite can meet these two situations at the same time, and provide a special optimization method with key scalability and design reusability to help cars   published on December 11, 2020      launch a complete radar sensor solution It can provide a 360 degree safety barrier for cars  According to foreign media reports, NXP semiconductors, the leader of automotive radar, announced the launch of a complete set of automotive sensor chipset solutions, which can wrap the car in a 360 degree security barrier and enable imaging radar to realize recognition and classification functions. The solution includes a new NXP radar processor and 77GHz transceiver, which provides a flexible and scalable configuration for automobile manufacturers to meet the NCAP requirements of vehicle corner radar and front-end radar. At the same time, it also provides a feasible way for the commercial mass production of 4D imaging radar for the first time. 4D imaging radar can improve the functions of radar ranging, velocity, direction, incidence angle and elevation. NXP is committed to reducing the number of road deaths by 1.3 million every year. This solution is conducive to achieving the above goals and represents the further development of radar, the core component of driving assistance system. NXP radar sensor solutions (photo source: NXP   published on December 09, 2020  < img SRC > "ALT =" NXP launched a complete radar sensor solution, which can provide 360 degree safety barrier for vehicles " />   the car is in urgent need of "lack of core": Volkswagen north and South stopped production, chip manufacturers increased the price of about 10000 sets, which has been unable to meet the market demandThe demand of the market. According to the current situation, nearly 15% of China's automobile production capacity is affected. In contrast to the shortage of chips, auto chip suppliers began to raise prices. Recently, NXP (En Zhipu), a leading chip maker of automobile chips, went out again. In November 26th, En Zhipu told clients that COVID-19 was affected by En Zhipu and faced the double impact of serious shortage of products and increased cost of raw materials, and decided to increase the price of products across the board. According to industry insiders, wafer supply will continue to be tight in the coming year. The price increase of NXP products may jump from 5%. Some products need customers to sign a one-year NCNR (no cancellation, no return) agreement. Prior to this, the market also heard that Renesas, a Japanese company, will adjust the prices of power management ICs and other products from January 1 next year. It is understood that if Zhixin is to be considered by Taiwan manufacturers, it may be published on December 7, 2020       that the "core shortage" of automobiles is urgent: Volkswagen north and South stops production, and chip manufacturers increase their prices on the whole line   ". Recently, NXP (En Zhipu), a leading chip maker of automobile chips, went out again. In November 26th, En Zhipu told clients that COVID-19 was affected by En Zhipu and faced the double impact of serious shortage of products and increased cost of raw materials, and decided to increase the price of products across the board. According to the industryIt shows that in the next year, wafer supply will continue to be tight. The price increase of NXP products may jump from 5%. Some products need customers to sign a one-year NCNR (no cancellation, no return) agreement. Prior to this, the market also heard that Renesas, a Japanese company, will adjust the prices of power management ICs and other products from January 1 next year. It is understood that Taiwan manufacturers may consider adjusting the prices of some products in order to reflect the cost. In addition, Maoda said that there is no plan to increase the price at present. Unless the upstream wafer OEM price is fully increased, it will discuss with customers, otherwise it will not take the initiative to increase the price.  published on December 4, 2020      NXP's second generation RF multi chip module is on the market, adopting the latest LDMOS technology   NXP semiconductor announced the launch of the second generation of Aircast RF power multi chip module (MCM), which is designed to meet the 5g requirements of cellular base stations The evolution requirements of MIMO active antenna system. The new all-in-one power amplifier module series focuses on speeding up the coverage of 5g network. It is based on the latest LDMOS technology of NXP, providing higher output power, wider frequency range and higher efficiency. Its overall dimensions are the same as the previous generation of MCM products of NXP. The new afsc5g26e38 airfast module was developed in the2 generation MCM series provides a model of higher performance. Compared with the previous generation products, the output power of the device is increased by 20%, so as to meet the requirement of providing a wider 5g coverage for each base station tower without increasing the size of the radio device. It also provides 45% power increase efficiency, four points higher than the previous generation, thus reducing the overall power consumption of 5g network. The new type   was published on December 3, 2020  < img SRC > "ALT =" NXP's second generation RF multi chip module is on the market, adopting the latest LDMOS technology / >     NXP s32k3 Three core automotive MCU with lock function   starting from s32k1 series, NXP semiconductor has used cortex-m7 core in a series of automotive microcontroller units (MCU). The new s32k3 series improves processor memory and performance, and features such as lock mode (Figure 1). Asymmetric cortex system on chip (SOC) is common, but they are usually used with Cortex-M0 + and high-end Cortex-M or in combination with cortex-a application processor. The s32k3 includes single core, dual core and triple core versions, and runs at up to 240 MHz. 1. S32k3 series can be extended from single core cortex-m7 to three coreOr dual core lock step system. S32k series for automotive applications. They have up to 8 MB flash memory and up to 256 KB SRAM memory with ECC function. Flash memory is set to two modules, allowing a / b firmware to exchange with automatic address translation. FOTA updates the load to a block   published on November 25, 2020  < img SRC > "ALT =" NXP s32k3 three core vehicle MCU with step locking function "/ >  in this paper
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